Electronic device, electronic apparatus, and moving object

ABSTRACT

An electronic device includes a vibration element having a detection signal electrode and a drive signal electrode, an IC disposed so as to be opposed to the vibration element, a first wiring pattern located between the IC and the vibration element, and electrically connected to the drive signal electrode, and a shield wiring pattern located on the vibration element side of the first wiring pattern, and electrically connected to a constant potential (ground).

BACKGROUND

1. Technical Field

The present invention relates to an electronic device, an electronicapparatus, and a moving object.

2. Related Art

In the past, as an electronic device for detecting an angular velocity,there has been known the electronic device described in JP-A-2012-79751(Document 1). The electronic device described in Document 1 has asemiconductor substrate, a stress relaxation layer disposed on theactive surface side of the semiconductor substrate, a wiring disposed onthe stress relaxation layer, and a vibration element disposed on thestress relaxation layer so as to electrically be connected to thewiring. By disposing the vibration element on the semiconductorsubstrate via the stress relaxation layer in such a manner as describedabove, height reduction of the electronic device can be achieved.

However, in such an electronic device, an electrostatic capacitanceoccurs between an electrode provided to the vibration element and wiringlines on the stress relaxation layer or between wiring lines on thesemiconductor substrate and the wiring lines on the stress relaxationlayer, and the noise due to the electrostatic capacitance is generated.Therefore, in the electronic device described in Document 1, there is aproblem that the detection accuracy of the angular velocity is degraded.

SUMMARY

An advantage of the invention is to provide an electronic device, anelectronic apparatus, and a moving object each capable of reducing thedegradation of the detection accuracy of the physical quantity.

The invention can be implemented as the following forms or applicationexamples.

Application Example 1

An electronic device according to this application example includes avibration element including a vibration body and an electrode providedto the vibration body, a substrate disposed so as to be opposed to thevibration element, a first wiring pattern located between the substrateand the vibration element, and electrically connected to a potentialdifferent from the electrode, and a first shield wiring pattern locatedon the vibration element side of the first wiring pattern, andelectrically connected to a constant potential.

According to this application example, it is possible to provide anelectronic device capable of reducing the degradation of detectionaccuracy of a physical quantity.

Application Example 2

In the electronic device according to the application example describedabove, it is preferable that the vibration body includes a drivevibrating section and a detection vibrating section, a drive signalelectrode electrically connected to the first wiring pattern is disposedin the drive vibrating section, and a detection signal electrode as theelectrode is disposed in the detection vibrating section.

According to this application example, mixture of noise into thedetection signal electrode and the drive signal electrode is reduced.

Application Example 3

In the electronic device according to the application example describedabove, it is preferable that the vibration body includes a drivevibrating section and a detection vibrating section, a drive signalelectrode as the electrode is disposed in the drive vibrating section,and a detection signal electrode electrically connected to the firstwiring pattern is disposed in the detection vibrating section.

According to this application example, mixture of noise into thedetection signal electrode and the drive signal electrode is reduced.

Application Example 4

In the electronic device according to the application example describedabove, it is preferable that the first shield wiring pattern isgrounded.

According to this application example, the configuration of the devicebecomes simple.

Application Example 5

In the electronic device according to the application example describedabove, it is preferable to further include a second wiring patternlocated on the substrate side of the first wiring pattern, andelectrically connected to a potential different from the first wiringpattern, and a second shield wiring pattern located between the firstwiring pattern and the second wiring pattern, and electrically connectedto a constant potential.

According to this application example, it is possible to further reducethe degradation of the detection accuracy of the physical quantity.

Application Example 6

An electronic device according to this application example includes avibration element including a vibration body and an electrode providedto the vibration body, a semiconductor substrate disposed so as to beopposed to the vibration element, a first wiring pattern located betweenthe semiconductor substrate and the vibration element, a second wiringpattern located between the first wiring pattern and the vibrationelement, and different in potential from the first wiring pattern, and ashield wiring pattern disposed at least a part of an area, which islocated between the first wiring pattern and the second wiring pattern,and in which the first wiring pattern and the second wiring patternoverlap each other in a planar view, the shield wiring pattern beingelectrically connected to a constant potential.

According to this application example, it is possible to provide anelectronic device capable of reducing the degradation of detectionaccuracy of a physical quantity.

Application Example 7

In the electronic device according to the application example describedabove, it is preferable that the vibration body includes a drivevibrating section and a detection vibrating section, the electrodeincludes a drive signal electrode disposed in the drive vibratingsection and a detection signal electrode disposed in the detectionvibrating section, and one of the first wiring pattern and the secondwiring pattern is electrically connected to the drive signal electrode,and the other of the first wiring pattern and the second wiring patternis electrically connected to the detection signal electrode.

According to this application example, mixture of noise into thedetection signal electrode and the drive signal electrode is reduced.

Application Example 8

In the electronic device according to the application example describedabove, it is preferable that the shield wiring pattern is grounded.

According to this application example, the configuration of the devicebecomes simple.

Application Example 9

In the electronic device according to the application example describedabove, it is preferable to further include an insulating layer disposedbetween the first wiring pattern and the shield wiring pattern.

According to this application example, it becomes easy to dispose thefirst wiring pattern and the shield wiring pattern.

Application Example 10

In the electronic device according to the application example describedabove, it is preferable to further include an insulating layer disposedbetween the second wiring pattern and the shield wiring pattern.

According to this application example, it becomes easy to dispose thesecond wiring pattern and the shield wiring pattern.

Application Example 11

In the electronic device according to the application example describedabove, it is preferable that the insulating layer has elasticity.

According to this application example, propagation of an impact to thevibration element is reduced.

Application Example 12

An electronic apparatus according to this application example includesthe electronic device according to any one of the application examplesdescribed above.

According to this application example, the electronic apparatus high inreliability can be obtained.

Application Example 13

A moving object according to this application example includes theelectronic device according to any one of the application examplesdescribed above.

According to this application example, the moving object high inreliability can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a cross-sectional view showing an electronic device accordingto a first embodiment of the invention.

FIG. 2 is a cross-sectional view of an IC provided to the electronicdevice shown in FIG. 1.

FIG. 3 is a plan view of a vibration element provided to the electronicdevice shown in FIG. 1.

FIGS. 4A and 4B are diagrams showing an electrode arrangement of thevibration element shown in FIG. 3, wherein FIG. 4A is a top view, andFIG. 4B is a transparent view.

FIGS. 5A and 5B are schematic diagrams for explaining an action of thevibration element shown in FIG. 3.

FIG. 6 is a cross-sectional view of a stress relaxation layer providedto the electronic device shown in FIG. 1.

FIG. 7 is a plan view of the stress relaxation layer shown in FIG. 6.

FIG. 8 is a plan view of the stress relaxation layer shown in FIG. 6.

FIGS. 9A and 9B are cross-sectional views of a shield wiring pattern.

FIG. 10 is a cross-sectional view of a stress relaxation layer providedto the electronic device according to a second embodiment of theinvention.

FIG. 11 is a plan view of the stress relaxation layer shown in FIG. 10.

FIG. 12 is a plan view of the stress relaxation layer shown in FIG. 10.

FIG. 13 is a plan view of the stress relaxation layer shown in FIG. 10.

FIGS. 14A and 14B are cross-sectional views for explaining an advantageof the shield wiring pattern.

FIG. 15 is a cross-sectional view of an IC provided to an electronicdevice according to a third embodiment of the invention.

FIG. 16 is a plan view of a vibration element provided to an electronicdevice according to a fourth embodiment of the invention.

FIG. 17 is a perspective view showing an electronic device according toa fifth embodiment of the invention.

FIG. 18 is a plan view of the electronic device shown in FIG. 17.

FIG. 19 is a plan view showing a modified example of the electronicdevice shown in FIG. 17.

FIG. 20 is a cross-sectional view showing an electronic device accordingto a sixth embodiment of the invention.

FIG. 21 is a cross-sectional view of a stress relaxation layer providedto the electronic device shown in FIG. 20.

FIG. 22 is a plan view of the stress relaxation layer shown in FIG. 21.

FIG. 23 is a plan view of the stress relaxation layer shown in FIG. 21.

FIGS. 24A and 24B are cross-sectional views showing a shield wiringpattern.

FIG. 25 is a cross-sectional view of a stress relaxation layer providedto an electronic device according to a seventh embodiment of theinvention.

FIG. 26 is a plan view of the stress relaxation layer shown in FIG. 25.

FIG. 27 is a plan view of the stress relaxation layer shown in FIG. 25.

FIG. 28 is a plan view of the stress relaxation layer shown in FIG. 25.

FIG. 29 is a cross-sectional view of an IC provided to an electronicdevice according to an eighth embodiment of the invention.

FIG. 30 is a plan view of a vibration element provided to an electronicdevice according to a ninth embodiment of the invention.

FIG. 31 is a perspective view showing an electronic device according toa tenth embodiment of the invention.

FIG. 32 is a plan view of the electronic device shown in FIG. 31.

FIG. 33 is a plan view showing a modified example of the electronicdevice shown in FIG. 31.

FIG. 34 is a perspective view showing a configuration of a personalcomputer to which the electronic apparatus equipped with the electronicdevice is applied.

FIG. 35 is a perspective view showing a configuration of a cellularphone to which the electronic apparatus equipped with the electronicdevice is applied.

FIG. 36 is a perspective view showing a configuration of a digital stillcamera to which the electronic apparatus equipped with the electronicdevice is applied.

FIG. 37 is a perspective view showing a configuration of a vehicle towhich a moving object quipped with the electronic device is applied.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, an electronic device, an electronic apparatus, and a movingobject according to the invention will be explained in detail based onsome embodiments shown in the accompanying drawings.

First Embodiment

FIG. 1 is a cross-sectional view showing an electronic device accordingto a first embodiment of the invention. FIG. 2 is a cross-sectional viewof an IC provided to the electronic device shown in FIG. 1. FIG. 3 is aplan view of a vibration element provided to the electronic device shownin FIG. 1. FIGS. 4A and 4B are diagrams showing an electrode arrangementof the vibration element shown in FIG. 3, wherein FIG. 4A is a top view,and FIG. 4B is a transparent view. FIGS. 5A and 5B are schematicdiagrams for explaining an action of the vibration element shown in FIG.3. FIG. 6 is a cross-sectional view of a stress relaxation layerprovided to the electronic device shown in FIG. 1. FIGS. 7 and 8 areeach a plan view of the stress relaxation layer shown in FIG. 6. FIGS.9A and 9B are cross-sectional views of a shield wiring pattern, forexplaining an advantage of the shield wiring pattern. It should be notedthat the upper side of FIG. 1 is also referred to as an “upper side” andthe lower side thereof is also referred to as a “lower side” in thefollowing descriptions for the sake of convenience of explanation.Further, as shown in FIG. 1, it is assumed that three axes perpendicularto each other are defined as an X axis, a Y axis, and a Z axis, and thethickness direction of the electronic device coincides with the Z axis.

The electronic device 1 shown in FIG. 1 is an angular velocity sensorcapable of detecting the angular velocity ωz around the Z axis. Such anelectronic device 1 includes a package 2 having a housing space Sinside, an IC 3 housed in the housing space S, a stress relaxation layer7 disposed on the IC 3, and a vibration element 6 disposed on the stressrelaxation layer 7. Hereinafter, each of these constituents willsequentially be explained.

Package

The package 2 includes a base 21 shaped like a box having a recessedsection 211 opening in the upper surface, a lid 22 shaped like a platefor blocking the opening of the recessed section 211, and a seam ring 23intervening between the base 21 and the lid 22 and adapted to bond thebase 21 and the lid 22 to each other. Further, the IC 3 and thevibration element 6 are housed in the housing space S formed by blockingthe opening of the recessed section 211 with the lid 22. It should benoted that the atmosphere in the housing space S is not particularlylimited, but is set to, for example, a vacuum state (a reduced pressurestate no higher than 10 Pa). Thus, the viscosity resistance is reduced,and it is possible to efficiently drive the vibration element 6.

Base 21

The base 21 has a roughly square planar shape. Further, the recessedsection 211 includes a first recessed section 211 a opening in the uppersurface of the base 21, and a second recessed section 211 b opening in acentral portion of a bottom surface of the first recessed section 211 aexcept an edge portion of the bottom surface. It should be noted thatthe planar shape of the base 21 is not particularly limited, but canalso be, for example, a rectangular shape or a circular shape. Such abase 21 can be formed by sintering a plurality of ceramic green sheets,which are formed of, for example, an aluminum oxide material, analuminum nitride material, a silicon carbide material, a mullitematerial, or a glass ceramic material, and are stacked one another.

Further, on the bottom surface of the first recessed section 211 a,there is disposed a plurality of internal terminals 241 electricallyconnected to the IC 3 via a bonding wires BW, and on the bottom surfaceof the base 21, there is disposed a plurality of external terminals 242.Further, the internal terminals 241 and the external terminals 242 areelectrically connected to each other via an internal wiring and so onnot shown and disposed to the base 21. The configuration of suchinternal terminals 241 and external terminals 242 is not particularlylimited, but it is possible to adopt a configuration in which afoundation layer made of, for example, tungsten (W), molybdenum (Mo), ormanganese (Mg) is covered with a metal layer made of gold (Au) or thelike.

The lid 22 has a plate-like shape, and is bonded to the upper surface ofthe base 21 via the seam ring 23. The constituent material of the lid 22is not particularly limited, but an alloy such as kovar is preferablyused. It should be noted that it is also possible for the lid 22 toelectrically be connected to a ground wiring via, for example, the seamring 23. Thus, it is possible to make the lid 22 function as a shieldsection for shielding against the noise from the outside of the package2.

IC

The IC 3 is fixed to the bottom surface of the second recessed section211 b with a silver paste or the like. The IC 3 includes an interfacesection 3 i for communicating with, for example, an external hostdevice, and a drive/detection circuit 3 z for driving the vibrationelement 6 to detect the angular velocity ωz applied to the vibrationelement 6.

Further, as shown in, for example, FIG. 2, the IC 3 includes a siliconsubstrate 31 as a substrate (a semiconductor substrate) having an activesurface 311 on which circuit elements such as transistor are disposed, awiring layer 32 stacked on the active surface 311 of the siliconsubstrate 31, and a passivation film 38 disposed on the wiring layer 32.Further, the wiring layer 32 includes a first insulating layer 321disposed on the silicon substrate 31, a first wiring pattern layer 322disposed on the first insulating layer 321, a second insulating layer323 disposed on the first insulating layer 321 and the first wiringpattern layer 322, a second wiring pattern layer 324 disposed on thesecond insulating layer 323, a third insulating layer 325 disposed onthe second insulating layer 323 and the second wiring pattern layer 324,a third wiring pattern layer 326 disposed on the third insulating layer325, a fourth insulating layer 327 disposed on the third insulatinglayer 325 and the third wiring pattern layer 326, and a fourth wiringpattern layer 328 disposed on the fourth insulating layer 327. It shouldbe noted that the configuration of the wiring layer 32 is not limited tothis example, but the number of the insulating layers or the wiringlayers stacked one another can also be no larger than 3, or no smallerthan 5, for example.

Further, the IC 3 is provided with a plurality of connection terminals37, 39 disposed on the upper surface, and the connection terminal 37 iselectrically connected to the vibration element 6 via the stressrelaxation layer 7, and the connection terminal 39 is electricallyconnected to the internal terminal 241 via the bonding wire BW. Thus, itis possible for the IC 3 to transmit and receive a signal to and fromthe vibration element 6, and at the same time, communicate with the hostdevice via the external terminal 242. It should be noted that thecommunication method of the IC 3 is not particularly limited, but it ispossible to use, for example, SPI (registered trademark; SerialPeripheral Interface, or I²C (registered trademark; Inter-IntegratedCircuit). Further, it is also possible for the IC 3 to have a selectionfunction for selecting the communication method to be able to select thecommunication method from the SPI and I²C. Thus, the electronic device 1compatible with a plurality of communication methods, and therefore highin convenience is obtained.

Vibration Element

As shown in FIGS. 3, 4A, and 4B, the vibration element 6 has a vibratingelement 60 made of quartz crystal, and electrodes disposed on thevibrating element 60. It should be noted that the material of thevibrating element 60 is not limited to quartz crystal, but it is alsopossible to use a piezoelectric material such as lithium tantalate orlithium niobate.

The vibrating element 60 has a plate-like shape having a spread in anx-y plane defined by an x axis (an electric axis) and a y axis (amechanical axis) as the crystal axes of the quartz crystal and athickness in a z-axis (an optical axis) direction. Such a vibratingelement 60 includes abase section 61, detection vibrating arms 621, 622as a pair of detection vibrating sections extending from the basesection 61 toward both sides in the y-axis direction, a pair ofconnecting arms 631, 632 extending from the base section 61 toward bothsides in the x-axis direction, drive vibrating arms 641, 642 as a pairof drive vibrating sections extending from a tip portion of theconnecting arm 631 toward both sides in the y-axis direction, drivevibrating arms 643, 644 as a pair of drive vibrating sections extendingfrom a tip portion of the connecting arm 632 toward both sides in they-axis direction, a pair of support sections 651, 652 for supporting thebase section 61, a pair of beam sections 661, 662 for connecting thesupport section 651 and the base section 61 to each other, and a pair ofbeam sections 663, 664 for connecting the support section 652 and thebase section 61. It should be noted that in such a vibrating element 60,the base section 61, the detection vibrating arms 621, 622, theconnecting arms 631, 632, and the drive vibrating arms 641 through 644constitute a vibration body 600.

Further, in both principal surfaces (an upper surface and a lowersurface) of each of the detection vibrating arms 621, 622, there areformed grooves each extending along the y-axis direction, and thus, thedetection vibrating arms 621, 622 each have a roughly H-shapedhorizontal cross-sectional shape. Further, the tip portion of each ofthe detection vibrating arms 621, 622, and the drive vibrating arms 641,642, 643, and 644 is provided with a hammerhead large in width. Itshould be noted that the configuration of the vibrating element 60 isnot limited to this example, but it is also possible to, for example,eliminate the grooves from the detection vibrating arms 621, 622, oreliminate the hammerheads from the detection vibrating arms 621, 622,and the drive vibrating arms 641, 642, 643, and 644. Further, it is alsopossible to form grooves in both principal surfaces of each of the drivevibrating arms 641, 642, 643, and 644 to provide a roughly H-shapedcross-sectional shape.

Then, the electrodes disposed on the vibrating element 60 will beexplained. As shown in FIGS. 4A and 4B, the electrodes include detectionsignal electrodes 671 a and detection signal terminals 671 b, detectionground electrodes 672 a and detection ground terminals 672 b, drivesignal electrodes 673 a and a drive signal terminal 673 b, and driveground electrodes 674 a and a drive ground terminal 674 b. It should benoted that in FIGS. 4A and 4B, for the sake of convenience ofexplanation, the detection signal electrodes 671 a and the detectionsignal terminals 671 b, the detection ground electrodes 672 a and thedetection ground terminals 672 b, the drive signal electrodes 673 a andthe drive signal terminal 673 b, and the drive ground electrodes 674 aand the drive ground terminal 674 b are shown with respective hatchingpatterns different from each other. Further, the electrodes, wiringlines, terminals, and so on formed on the side surfaces of the vibratingelement 60 are shown with heavy lines.

Drive Signal Electrodes and Drive Signal Terminal

The drive signal electrodes 673 a are respectively disposed on the uppersurface and the lower surface of each of the drive vibrating arms 641,642, and both side surfaces of each of the drive vibrating arms 643,644. Such drive signal electrodes 673 a are electrodes for exciting thedrive vibrations of the drive vibrating arms 641 through 644.

The drive signal terminal 673 b is disposed in an end portion located onthe −X-axis side of the support section 652. Further, the drive signalterminal 673 b is electrically connected to the drive signal electrodes673 a, which are disposed on the drive vibrating arms 641 through 644,via the drive signal wiring line disposed on the beam section 664.

Drive Ground Electrodes and Drive Ground Terminal

The drive ground electrodes 674 a are respectively disposed on the uppersurface and the lower surface of each of the drive vibrating arms 643,644, and both side surfaces of each of the drive vibrating arms 641,642. Such drive ground electrodes 674 a have an electrical potential tobe a constant potential (a reference potential) with respect to thedrive signal electrodes 673 a. Here, the constant potential denotes aground potential or a potential fixed to a certain potential.

The drive ground terminal 674 b is disposed in an end portion located onthe −X-axis side of the support section 651. Further, the drive groundterminal 674 b is electrically connected to the drive ground electrodes674 a, which are disposed on the drive vibrating arms 641 through 644,via the drive ground wiring line disposed on the beam section 662.

By disposing the drive signal electrodes 673 a and the drive signalterminal 673 b, and the drive ground electrodes 674 a and the driveground terminal 674 b in such a manner as described above, it ispossible to generate an electric field between the drive signalelectrodes 673 a and the drive ground electrodes 674 a respectivelydisposed on the drive vibrating arms 641 through 644 by applying thedrive signal between the drive signal terminal 673 b and the driveground terminal 674 b, to thereby make the drive vibrating arms 641through 644 perform drive vibrations.

Detection Signal Electrodes and Detection Signal Terminals

The detection signal electrodes 671 a are respectively disposed on theupper surface and the lower surface (the inner surface of the groove) ofeach of the detection vibrating arms 621, 622. Such detection signalelectrodes 671 a are electrodes for detecting the charge generated bydetection vibrations of the detection vibrating arms 621, 622 when thedetection vibrations are excited.

The detection signal terminal 671 b is disposed on each of the supportsections 651, 652. The detection signal terminal 671 b disposed on thesupport section 651 is disposed in an end portion located on the +x-axisside of the support section 651, and is electrically connected to thedetection signal electrodes 671 a disposed on the detection vibratingarm 621 via the detection signal wiring line formed on the beam section661. On the other hand, the detection signal terminal 671 b disposed onthe support section 652 is disposed in an end portion located on the+x-axis side of the support section 652, and is electrically connectedto the detection signal electrodes 671 a disposed on the detectionvibrating arm 622 via the detection signal wiring line formed on thebeam section 663.

Detection Ground Electrodes and Detection Ground Terminals

The detection ground electrodes 672 a are respectively disposed on bothside surfaces of each of the detection vibrating arms 621, 622. Suchdetection ground electrodes 672 a have an electrical potential to be aconstant potential (a reference potential) with respect to the detectionsignal electrodes 671 a. Here, the constant potential denotes a groundpotential or a potential fixed to a certain potential.

The detection ground terminal 672 b is disposed on each of the supportsections 651, 652. The detection ground terminal 672 b disposed on thesupport section 651 is disposed in a central portion of the supportsection 651, and is electrically connected to the detection groundelectrodes 672 a disposed on the detection vibrating arm 621 via thedetection ground wiring line formed on the beam section 661. On theother hand, the detection ground terminal 672 b disposed on the supportsection 652 is disposed in a central portion of the support section 652,and is electrically connected to the detection ground electrodes 672 adisposed on the detection vibrating arm 622 via the detection groundwiring line formed on the beam section 663.

By disposing the detection signal electrodes 671 a and the detectionsignal terminals 671 b, and the detection ground electrodes 672 a andthe detection ground terminals 672 b in such a manner as describedabove, the detection vibration generated in the detection vibrating arm621 appears as the charge between the detection signal electrodes 671 aand the detection ground electrodes 672 a disposed on the detectionvibrating arm 621, and can be taken out as a signal between thedetection signal terminal 671 b and the detection ground terminal 672 bdisposed on the support section 651. Further, the detection vibrationgenerated in the detection vibrating arm 622 appears as the chargebetween the detection signal electrodes 671 a and the detection groundelectrodes 672 a disposed on the detection vibrating arm 622, and can betaken out as a signal between the detection signal terminal 671 b andthe detection ground terminal 672 b disposed on the support section 652.

The configuration of the electrodes is not particularly limited as longas electrical conductively is provided, but the electrodes each can beformed of a metal coating obtained by stacking a coat made of Ni(nickel), Au (gold), Ag (silver), Cu (copper), or the like on ametalization layer (a foundation layer) made of, for example, Cr(chromium), or W (tungsten).

Such a vibration element 6 is fixed to the stress relaxation layer 7 inthe support sections 651, 652. Further, fixation of the vibrationelement 6 to the stress relaxation layer 7 is achieved using fixationmembers (connecting members) 8 having electrical conductivity, and thevibration element 6 and the IC 3 are electrically connected to eachother via the fixation members 8 and the stress relaxation layer 7. Thefixation member 8 is not particularly limited, but there can be used,for example, a metal brazing material, a metal bump, or an electricallyconductive adhesive.

Then an action of the vibration element 6 will be explained.

In the state in which no angular velocity is applied to the vibrationelement 6, when the drive signal is applied between the drive signalterminal 673 b and the drive ground terminal 674 b to thereby generatethe electric field between the drive signal electrodes 673 a and thedrive ground electrode 674 a, each of the drive vibrating arms 641, 642,643, and 644 flexurally vibrates in the direction indicated by the arrowA as shown in FIG. 5A. On this occasion, since the drive vibrating arms641, 642 and the drive vibrating arms 643, 644 vibrate symmetricallywith respect to the base section 61, the detection vibrating arms 621,622 hardly vibrate.

When the angular velocity ωz is applied to the vibration element 6 inthe state of performing the drive vibration described above, thedetection vibration shown in FIG. 5B is excited. Specifically, Coriolisforce in the arrow B direction acts on the drive vibrating arms 641through 644, and the connecting arms 631, 632, and thus a new vibrationis excited. Further, in accordance with the vibration of the arrow B,the detection vibration in the arrow C direction is excited in thedetection vibrating arms 621, 622. Then, the charge generated in thedetection vibrating arms 621, 622 due to the vibration is taken out fromthe detection signal electrodes 671 a and the detection groundelectrodes 672 a as a signal, and is transmitted to the IC 3 from thedetection signal terminals 671 b and the detection ground terminals 672b. Then, by processing the signal in the IC 3, the angular velocity ωzis obtained.

Stress Relaxation Layer

As shown in FIG. 6, the stress relaxation layer 7 is located between theIC 3 and the vibration element 6, and is disposed on the upper surfaceof the IC 3. By disposing the stress relaxation layer 7, an impactreceived by the package 2 is relaxed, and it becomes difficult for theimpact to be transmitted to the vibration element 6. Further, the stresscaused by the difference in thermal expansion between the IC 3 and thevibration element 6 is relaxed, and it becomes difficult for thevibration element 6 to bend. Therefore, the mechanical strength of theelectronic device 1 can be increased, and at the same time, the angularvelocity ωz can more accurately be detected.

Such a stress relaxation layer 7 has a first insulating layer 71 stackedon the upper surface (on a passivation film 38) of the IC 3, a firstwiring pattern layer disposed on the first insulating layer 71, a secondinsulating layer 73 disposed on the first insulating layer 71 and thefirst wiring pattern layer 72, and a second wiring pattern layer 74disposed on the second insulating layer 73.

Further, the first insulating layer 71 and the second insulating layer73 each have elasticity. Therefore, the relaxation of the impactdescribed above can be achieved. The constituent material of such firstinsulating layer 71 and second insulating layer 73 is not particularlylimited, but there can be used a resin material such as polyimide,silicone-modified polyimide resin, epoxy resin, silicone-modified epoxyresin, acrylic resin, phenol resin, silicone resin, modified polyimideresin, benzocyclobutene, or polybenzooxazole. Thus, it is possible toform the first insulating layer 71 and the second insulating layer 73each having sufficient elasticity, and thus, the advantages describedabove can more surely be exerted.

Further, as shown in FIG. 7, the second wiring pattern layer 74 has sixterminals (connection pads) 741 disposed so as to be opposed to therespective terminals (connection electrodes) 671 b through 674 bdisposed on the support sections 651, 652 of the vibration element 6.Further, the vibration element 6 is fixed to the terminals 741 via thefixation members 8. Meanwhile, as shown in FIG. 8, the first wiringpattern layer 72 has wiring sections 721 for electrically connecting theterminals 741 of the second wiring pattern layer 74 and the connectionterminals 37 of the IC 3, respectively. Thus, the IC 3 and the vibrationelement 6 are electrically connected to each other via the fixationmembers 8 and the stress relaxation layer 7, and it is possible totransmit and receive the signals between the IC 3 and the vibrationelement 6. As described above, the first wiring pattern layer 72 and thesecond wiring pattern layer 74 function as a wiring (relocation wiring)for electrically connecting the IC 3 and the vibration element 6 to eachother. Therefore, for example, the connection terminals 37 of the IC 3can freely be disposed without taking the positions of the terminals 671b through 674 b of the vibration element 6 into consideration.Therefore, the flexibility in design of the electronic device 1 isenhanced.

Further, the second wiring pattern layer 74 has a shield wiring pattern(first shield wiring pattern) 742 besides the terminals 741. The shieldwiring pattern 742 is disposed so as to spread on the second insulatinglayer 73 as long as the arrangement of the terminals 741 is nothindered. Further, the shield wiring pattern 742 is electricallyconnected to a constant potential, in particular, to the ground in thepresent embodiment. Here, the constant potential denotes a groundpotential or a potential fixed to a certain potential. Such a shieldwiring pattern 742 is located between the vibration element 6 and thewiring sections 721, and functions as a shield layer for reducing thecapacitive coupling (the capacitance between the electrodes provided tothe vibration element 6 and the wiring sections 721) between theelectrodes provided to the vibration element 6 and the wiring sections721. Therefore, by disposing the shield wiring pattern 742, the S/Nratio is improved, and the electronic device 1 capable of moreaccurately detecting the angular velocity is obtained. Further, even inthe case in which the noise has temperature dependency, since the noiseitself can be reduced, the electronic device 1 superior in temperaturecharacteristics is obtained.

In the more specific explanation, as shown in FIG. 9A, there is disposedthe shield wiring pattern 742 between the detection signal electrodes671 a provided to the vibration element 6 and a wiring section (a firstwiring pattern) 721 a provided to the first wiring pattern layer 72 andelectrically connected to the drive signal terminal 673 b. Therefore,mixture of noise from the wiring section 721 a into the detection signalelectrodes 671 a is reduced, and thus, a more accurate detection signalcan be transmitted to the IC 3.

Similarly, as shown in FIG. 9B, there is disposed the shield wiringpattern 742 between the drive signal electrodes 673 a provided to thevibration element 6 and wiring sections (the first wiring pattern) 721 bprovided to the first wiring pattern layer 72 and electrically connectedto the detection signal terminals 671 b. Therefore, mixture of noisefrom the drive signal electrodes 673 a into the wiring sections 721 b isreduced, and thus, a more accurate detection signal can be transmittedto the IC 3. By disposing the shield wiring pattern 742 in such a manneras described above, the electronic device 1 capable of more accuratelydetecting the angular velocity is obtained.

Here, the method of connecting the shield wiring pattern 742 to theground is not particularly limited. For example, it is also possible forthe shield wiring pattern 742 to be electrically connected to the groundwiring included in the IC 3. According to this method, since the wiringoriginally provided to the IC 3 can be used, there is obtained anadvantage that a complication (an increase in size) of the device is notinvolved.

Further, as another method, it is also possible to dispose a dedicatedwiring, which connects the shield wiring pattern 742 to the ground, onthe upper surface (a fourth wiring pattern layer 328) of the IC 3,electrically connect the shield wiring pattern 742 to the dedicatedwiring, and electrically connect the dedicated wiring and the internalterminal 241 for grounding to each other with a bonding wire BW.According to such a method as described above, since the shield wiringpattern 742 can be connected to the ground without the intervention ofthe internal wiring of the IC 3, the impedance of the wiring linebetween the shield wiring pattern 742 and the ground can be reduced.Therefore, the shield effect of the shield wiring pattern 742 canfurther be enhanced. It should be noted that in this method, it is alsopossible to share the internal terminal 241 for grounding with the IC 3,or to separately dispose the internal terminal 241 for the IC 3 and theinternal terminal 241 for the shield wiring pattern 742, but it ispreferable to share the internal terminal 241. Thus, it is possible toprevent an increase in the number of components to thereby prevent anincrease in size and degradation in reliability of the device.

Further, as another method, it is also possible to directly connect theshield wiring pattern 742 to the internal terminal 241 for groundingdisposed on the package 2 with a bonding wire or the like without theintervention of a wiring disposed in the IC 3 or a wiring disposed onthe IC 3. Thus, the configuration of the device becomes simpler.Further, it is possible to further decrease the impedance of the wiringline between the shield wiring pattern 742 and the ground.

Second Embodiment

FIG. 10 is a cross-sectional view of a stress relaxation layer providedto an electronic device according to a second embodiment of theinvention. FIGS. 11 through 13 are each a plan view of the stressrelaxation layer shown in FIG. 10. FIGS. 14A and 14B are cross-sectionalview for explaining an advantage of the shield wiring pattern.Hereinafter, the second embodiment will be explained with a focus on thedifferences from the first embodiment described above, and regardingsubstantially the same matters, the same reference symbols are provided,and the explanation thereof will be omitted.

The electronic device according to the second embodiment is different inthe configuration of the stress relaxation layer from the firstembodiment.

As shown in FIG. 10, the stress relaxation layer 7A provided to theelectronic device 1A according to the present embodiment includes afirst insulating layer 71A stacked on the upper surface (on thepassivation film 38) of the IC 3, a first wiring pattern layer 72Adisposed on the first insulating layer 71A, a second insulating layer73A disposed on the first insulating layer 71A and the first wiringpattern layer 72A, a second wiring pattern layer 74A disposed on thesecond insulating layer 73A, a third insulating layer 75 disposed on thesecond insulating layer 73A and the second wiring pattern layer 74A, anda third wiring pattern layer 76 disposed on the third insulating layer75. In the stress relaxation layer 7A having such a configuration asdescribed above, since the number of insulating layers having elasticityis larger than, for example, that in the first embodiment describedabove, the impact relaxation characteristic is further improved.

Further, as shown in FIGS. 10 and 11, the third wiring pattern layer 76has six terminals (connection pads) 761 disposed so as to be opposed tothe respective terminals (connection electrodes) 671 b through 674 bdisposed on the support sections 651, 652 of the vibration element 6.Further, the vibration element 6 is fixed to the terminals 761 via thefixation members 8. Further, the third wiring pattern layer 76 has ashield wiring pattern (first shield wiring pattern) 762. The shieldwiring pattern 762 is disposed so as to spread on the third insulatinglayer 75 as long as the arrangement of the terminals 761 is nothindered. Further, the shield wiring pattern 762 is electricallyconnected to a constant potential, in particular, to the ground in thepresent embodiment. The advantages of the shield wiring pattern 762 aresubstantially the same as those of the first embodiment described above.

Further, as shown in FIG. 12, the second wiring pattern layer 74A haswiring sections 743A electrically connected to the terminals 761.Further, as shown in FIG. 13, the first wiring pattern layer 72A haswiring sections 721A for electrically connecting the wiring sections743A of the second wiring pattern layer 74A and the connection terminals37 of the IC 3, respectively, and a shield wiring pattern (second shieldwiring pattern) 722A.

The shield wiring pattern 722A is located between the second wiringpattern layer 74A and the IC 3, and therefore functions as a shieldwiring pattern for reducing the capacitive coupling between the secondwiring pattern layer 74A and the IC 3. Therefore, by disposing theshield wiring pattern 762, the electronic device 1A capable of moreaccurately detecting the angular velocity is obtained.

In the more specific explanation, since the shield wiring pattern 722Ais disposed between the wiring sections (the first wiring pattern) 743 aprovided to the second wiring pattern layer 74A and electricallyconnected respectively to the detection signal terminals 671 b and awiring section (second wiring pattern) 32 a provided to the IC 3 (thewiring layer 32) and electrically connected to the drive signal terminal673 b as shown in FIG. 14A, mixture of noise from the wiring section 32a into the wiring sections 743 a is reduced, and thus, it is possible totransmit a more accurate detection signal to the IC 3. Similarly, sincethe shield wiring pattern 722A is disposed between a wiring section 743b provided to the second wiring pattern layer 74A and electricallyconnected to the drive signal terminal 673 b and wiring sections (thesecond wiring pattern) 32 b provided to the IC 3 (the wiring layer 32)and electrically connected respectively to the detection signalterminals 671 b, mixture of noise from the wiring section 743 b into thewiring sections 32 b is reduced, and thus, it is possible to transmit amore accurate detection signal to the IC 3. By disposing the shieldwiring pattern 722A in such a manner as described above, the electronicdevice 1A capable of more accurately detecting the angular velocity isobtained.

According also to such a second embodiment as described above,substantially the same advantages as in the first embodiment describedabove can be obtained.

Third Embodiment

FIG. 15 is a cross-sectional view of an IC provided to an electronicdevice according to a third embodiment of the invention. Hereinafter,the third embodiment will be explained with a focus on the differencesfrom the second embodiment described above, and regarding substantiallythe same matters, the same reference symbols are provided, and theexplanation thereof will be omitted.

The electronic device according to the third embodiment is differentfrom the second embodiment in the configuration of the IC and the stressrelaxation layer.

As shown in FIG. 15, in the electronic device 1B according to thepresent embodiment, a shield wiring pattern (second shield wiringpattern) 328 a is disposed in the IC 3B. Specifically, the shield wiringpattern 328 a is disposed as apart of a fourth wiring pattern layer 328provided to a wiring layer 32B of the IC 3B. By disposing the shieldwiring pattern 328 a in the IC 3B as described above, it is possible toexert substantially the same advantages as in the second embodimentdescribed above, and at the same time, the following advantages canfurther be exerted.

That is, by disposing the shield wiring pattern 328 a in the IC 3B, inthe stress relaxation layer 7B, the first insulating layer 71 and thefirst wiring pattern layer 72 for disposing the second shield wiringpattern can be omitted. Therefore, the stress relaxation layer 7B can bemade thinner, and it is possible to achieve height reduction of theelectronic device 1B.

According also to such a third embodiment as described above,substantially the same advantages as in the first embodiment describedabove can be obtained.

Fourth Embodiment

FIG. 16 is a plan view of a vibration element provided to an electronicdevice according to a fourth embodiment of the invention. Hereinafter,the fourth embodiment will be explained with a focus on the differencesfrom the first embodiment described above, and regarding substantiallythe same matters, the same reference symbols are provided, and theexplanation thereof will be omitted.

The electronic device according to the fourth embodiment is different inthe configuration of the vibration element from the first embodiment.

The vibration element 5 provided to the electronic device 1C accordingto the present embodiment is a so-called “H-type” gyro element, and iscapable of detecting the angular velocity ωx around the X axis. As shownin FIG. 16, such a vibration element 5 has a vibrating element 50 madeof quartz crystal, and electrodes disposed on the vibrating element 50.It should be noted that the material of the vibrating element 50 is notlimited to quartz crystal, but it is also possible to use apiezoelectric material such as lithium tantalate or lithium niobate.

The vibrating element 50 has a plate-like shape having a spread in anx-y plane defined by an x axis (an electric axis) and a y axis (amechanical axis) as the crystal axes of the quartz crystal and athickness in a z-axis (an optical axis) direction. Further, thevibrating element 50 has a base section 51, a pair of drive vibratingarms 521, 522 extending from the base section 51 toward the −y-axis sidein parallel to each other, a pair of detection vibrating arms 531, 532extending from the base section 51 toward the +y-axis side in parallelto each other, a pair of adjustment vibrating arms 541, 542 extendingfrom the base section 51 toward the +y-axis side and located on bothsides of the detection vibrating arms 531, 532, a support section 55 forsupporting the base section 51, and connecting sections 56 forconnecting the base section 51 and the support section 55 to each other.It should be noted that in such a vibrating element 50, the base section51, the drive vibrating arms 521, 522, the detection vibrating arms 531,532, and the adjustment vibrating arms 541, 542 constitute a vibrationbody 500.

Such a vibration element 5 is fixed to the stress relaxation layer 7 inthe support section 55. Further, fixation of the vibration element 5 tothe stress relaxation layer 7 is achieved using fixation members 8, andthe vibration element 5 and the IC 3 are electrically connected to eachother via the fixation members 8 and the stress relaxation layer 7.

The drive vibrating arms 521, 522 are provided with drive signalelectrodes not shown, and by applying an oscillation drive signal (analternating voltage) from the IC 3 to the drive signal electrodes, adrive mode indicated by the arrows D is excited. Then, when the angularvelocity ωx around the X axis is applied while the drive vibrating arms521, 522 are vibrating in the drive mode, a detection mode indicated bythe arrows E is excited, and thus, the detection vibrating arms 531, 532vibrate. The detection vibrating arms 531, 532 are provided withdetection signal electrodes not shown, and a detection signal (thecharge) generated by the vibration of the detection vibrating arms 531,532 is taken out through the detection signal electrodes. Then, the IC 3detects the angular velocity ωx based on the detection signal thus takenout.

According also to such a fourth embodiment as described above,substantially the same advantages as in the first embodiment describedabove can be exerted.

Fifth Embodiment

FIG. 17 is a perspective view showing an electronic device according toa fifth embodiment of the invention. FIG. 18 is a plan view of theelectronic device shown in FIG. 17. FIG. 19 is a plan view showing amodified example of the electronic device shown in FIG. 17. Hereinafter,the fifth embodiment will be explained with a focus on the differencesfrom the first embodiment described above, and regarding substantiallythe same matters, the same reference symbols are provided, and theexplanation thereof will be omitted.

The electronic device according to the fifth embodiment is differentfrom the first embodiment in the configuration provided with a pluralityof vibration elements.

The electronic device 1D according to the present embodiment is atriaxial angular velocity sensor, and is capable of detecting theangular velocity ωx around the X axis, the angular velocity ωy aroundthe Y axis, and the angular velocity ωz around the Z axis independentlyof each other. As shown in FIG. 17, such an electronic device 1D has apackage 2D provided with a housing space S formed inside, an IC 3Dhoused in the package 2D, and three vibration elements 4, 5, and 6disposed on the IC 3D via a stress relaxation layer 7D. It should benoted that the vibration elements 5, 6 each have substantially the sameconfiguration as explained in the above description of the embodiments,and the vibration element 4 has substantially the same configuration asthat of the vibration element 5 except the point that vibration elementis disposed in a different orientation.

IC

The IC 3D has a roughly rectangular planar shape, and the outer shape inthe planar view includes a pair of outer edges 3Da, 3Db disposed so asto extend in the Y-axis direction, and a pair of outer edges 3Dc, 3Dddisposed so as to extend in the X-axis direction as shown in FIG. 18.

The IC 3D includes, for example, an interface section 3 i forcommunicating with an external host device, a drive/detection circuit 3y for driving the vibration element 4 to detect the angular velocity ωyapplied to the vibration element 4, a drive/detection circuit 3 x fordriving the vibration element 5 to detect the angular velocity ωxapplied to the vibration element 5, and a drive/detection circuit 3 zfor driving the vibration element 6 to detect the angular velocity ωzapplied to the vibration element 6.

Here, as shown in FIG. 18, a plurality of connection terminals 39 isdisposed separately in three areas, namely a first terminal arrangementarea SS1, a second terminal arrangement area SS2, and a third terminalarrangement area SS3, set on the upper surface of the IC 3D. The firstterminal arrangement area SS1 is disposed along the outer edge 3Dc so asto be shifted toward the outer edge 3Da, the second terminal arrangementarea SS2 is disposed along the outer edge 3Dd so as to be shifted towardthe outer edge 3Da, and the third terminal arrangement area SS3 isdisposed along the outer edge 3Db so as to be shifted toward the outeredge 3Dd.

In the first terminal arrangement area SS1, there are disposed digitalsignal terminals in a lump such as a digital signal terminal for a slaveselection signal SS for selecting a communication method, a digitalsignal terminal for a data input signal MOSI, a digital signal terminalfor a clock signal SCLK, and a digital signal terminal for a data outputsignal MISO. Further, in the second terminal arrangement area SS2 andthe third terminal arrangement area SS3, there are disposed analogsignal terminals in a lump such as a ground terminal for the ground GND,a power supply signal terminal for the power supply VDDI of theinterface section 3 i, a power supply signal terminal for the powersupply VDD of the drive/detection circuits 3 x, 3 y, and 3 z, and a testsignal terminal for testing.

By disposing the digital signal terminals and the analog signalterminals separately in the respective areas different from each otheras described above, mixture of digital signals into the analog signalterminals (wiring) can be reduced. Therefore, the electronic device 1Dcapable of reducing the noise, and thus capable of performing moreaccurate drive is obtained. In particular, in the present embodiment,since there is adopted an arrangement of disposing the first terminalarrangement area SS1 distant from the second terminal arrangement areaSS2 and the third terminal arrangement area SS3 as much as possible, theadvantages described above can more effectively be exerted.

Arrangement of Vibration Elements

As shown in FIG. 18, the vibration element 4 is arranged so that adetection axis J4 coincides with the Y axis. Thus, the vibration element4 can detect the angular velocity ωy. Further, the vibration element 4is disposed on the upper surface of the IC 3D at a position shiftedtoward the outer edge 3Db and the outer edge 3Dd. Further, on the+X-axis side of the vibration element 4 (between the vibration element 4and the outer edge 3Db), there is located the third terminal arrangementarea SS3, and on the −X-axis side of the vibration element 4 (betweenthe vibration element 4 and the outer edge 3Da), there is located thesecond terminal arrangement area SS2. Further, the vibration element 4is disposed so that the detection vibrating arms 431, 432 and theadjustment vibrating arms 441, 442 protrude from the outer edge 3Dd ofthe IC 3D toward the +Y side in a planar view. In other words, thevibration element 4 is disposed so that the detection vibrating arms431, 432 and the adjustment vibrating arms 441, 442 do not overlap theIC 3D in the planar view.

Then an arrangement of the vibration element 5 will be explained. Asshown in FIG. 18, the vibration element 5 is arranged so that adetection axis J5 coincides with the X axis. Thus, the vibration element5 can detect the angular velocity ωx. Further, the vibration element 5is disposed on the upper surface of the IC 3D at a position shiftedtoward the outer edge 3Db and the outer edge 3Dc. Therefore, thevibration element 5 is located on the −Y-axis side with respect to thevibration element 4 (between the vibration element 4 and the outer edge3Dc). Further, on the −X-axis side of the vibration element 5 (betweenthe vibration element 5 and the outer edge 3Da), there is located thefirst terminal arrangement area SS1. Further, the vibration element 5 isdisposed so that the detection vibrating arms 531, 532 and theadjustment vibrating arms 541, 542 protrude from the outer edge 3Db ofthe IC 3D toward the +X side in the planar view.

Then an arrangement of the vibration element 6 will be explained. Asshown in FIG. 18, the vibration element 6 is arranged so that adetection axis J6 coincides with the Z axis. Thus, the vibration element6 can detect the angular velocity (oz. Further, the vibration element 6is disposed on the upper surface of the IC 3D at a position shiftedtoward the outer edge 3Da. Therefore, the vibration element 6 is locatedon the −X-axis side with respect to the vibration elements 4, 5 (betweenthe vibration elements 4, 5 and the outer edge 3Da). Further, on the−Y-axis side of the vibration element 6 (between the vibration element 6and the outer edge 3Dc), there is located the first terminal arrangementarea SS1, and on the +Y-axis side (between the vibration element 6 andthe outer edge 3Dd), there is located the second terminal arrangementarea SS2.

Further, the vibration element 6 is disposed so as to be shifted towardthe second terminal arrangement area SS2 rather than the first terminalarrangement area SS1. In other words, the vibration element 6 isdisposed so that the distance DSS2 from the second terminal arrangementarea SS2 is shorter than the distance DSS1 from the first terminalarrangement area SS1. Thus, it is possible to make the vibration element6 distant from the first terminal arrangement area SS1 as much aspossible, and thus, the mixture of the digital signal into the vibrationelement 6 is reduced. Therefore, the electronic device 1D capable ofreducing the mixture of noise into the drive signal or the detectionsignal, and thus capable of performing more accurate drive is obtained.

Further, the vibration element 6 is disposed so that the direction, inwhich the support sections 651, 652 are arranged, coincides with theY-axis direction. Since the length of the vibration element 6 in thedirection, in which the support sections 651, 652 are arranged, islarger than the length thereof in the direction (the direction in whichthe connecting arms 631, 632 extend) perpendicular to the direction, inwhich the support sections 651, 652 are arranged, by disposing thevibration element 6 as described above, it is possible to make effectiveuse of the space on the upper surface of the IC 3D. Therefore, forexample, the distance between the outer edges 3Da, 3Db can be madeshorter, and miniaturization of the IC 3D can be achieved.

By disposing the vibration elements 4, 5 in an area located on the uppersurface of the IC 3D and on the outer edge 3Db side so as to be arrangedside by side in the Y-axis direction, and further disposing thevibration element 6 in an area located on the upper surface of the IC 3Dand on the outer edge 3Da side as described above, it is possible todispose these three vibration elements 4, 5, and 6 in a relatively smallspace. Therefore, miniaturization of the IC 3D can be achieved, andaccordingly, miniaturization of the electronic device 1D can beachieved.

Stress Relaxation Layer

The stress relaxation layer 7D has a first stress relaxation layer 7Dadisposed between the IC 3D and the vibration element 4, and having thevibration element 4 disposed on the upper surface thereof, a secondstress relaxation layer 7Db disposed between the IC 3D and the vibrationelement 5, and having the vibration element 5 disposed on the uppersurface thereof, and a third stress relaxation layer 7Dc disposedbetween the IC 3D and the vibration element 6, and having the vibrationelement 6 disposed on the upper surface thereof. By dividing the stressrelaxation layer 7D into the parts corresponding respectively to thevibration elements 4, 5, and 6 in such a manner as described above, itbecomes difficult for the vibrations of the vibration elements 4, 5, and6 from propagating to each other. Therefore, it is possible for each ofthe vibration elements 4, 5, and 6 to more accurately detect the angularvelocity. It should be noted that although the configuration of each ofthe first stress relaxation layer 7Da, the second stress relaxationlayer 7Db, and the third stress relaxation layer 7Dc is substantiallythe same as the configuration of the stress relaxation layer 7 describedin the description of the first embodiment, and therefore theexplanation thereof will be omitted, it is also possible to use theconfiguration of the stress relaxation layer 7A described in thedescription of the second embodiment.

According also to such a fifth embodiment as described above,substantially the same advantages as in the first embodiment describedabove can be obtained.

Modified Example

Although in the fifth embodiment described above, the stress relaxationlayer 7D is divided into the first stress relaxation layer 7Da, thesecond stress relaxation layer 7Db, and the third stress relaxationlayer 7Dc, it is also possible to adopt an electronic device 1E providedwith a stress relaxation layer 7E obtained by integrally forming a firststress relaxation layer 7Ea, a second stress relaxation layer 7Eb, andthe third stress relaxation layer 7Ec with each other as shown in FIG.19, for example. In other words, it is also possible to dispose threevibration elements 4, 5, and 6 on the single stress relaxation layer 7E.Thus, since no gaps exist between the first stress relaxation layer 7Ea,the second stress relaxation layer 7Eb, and the third stress relaxationlayer 7Ec, mixture of the noise through the gaps is prevented, and thus,the shield effect can be improved.

Sixth Embodiment

FIG. 20 is a cross-sectional view showing an electronic device accordingto a sixth embodiment of the invention. FIG. 21 is a cross-sectionalview of a stress relaxation layer provided to the electronic deviceshown in FIG. 20. FIGS. 22 and 23 are each a plan view of the stressrelaxation layer shown in FIG. 21. FIGS. 24A and 24B are cross-sectionalviews showing a shield wiring pattern. It should be noted that the upperside of FIG. 20 is also referred to as an “upper side” and the lowerside thereof is also referred to as a “lower side” in the followingdescriptions for the sake of convenience of explanation. Further, asshown in FIG. 20, it is assumed that three axes perpendicular to eachother are defined as an X axis, a Y axis, and a Z axis, and thethickness direction of the electronic device coincides with the Z axis.

The sixth embodiment will be explained with a focus on the differencesfrom the first embodiment described above, and regarding substantiallythe same matters, the same reference symbols are provided, and theexplanation thereof will be omitted.

The electronic device according to the sixth embodiment is different inthe IC and the stress relaxation layer from the first embodiment.

The electronic device 1 shown in FIG. 20 is an angular velocity sensorcapable of detecting the angular velocity ωz around the Z axis. Such anelectronic device 1 includes a package 2 having a housing space Sinside, an IC 3F housed in the housing space S, a stress relaxationlayer 7F disposed on the IC 3F, and a vibration element 6 disposed onthe stress relaxation layer 7F.

IC

In the IC 3F, wiring sections (first wiring pattern) 32Fa, 32Fbelectrically connected to the drive signal terminal 673 b of thevibrating element 6 are disposed in a fourth wiring pattern layer 328Fof the wiring layer 32F.

Stress Relaxation Layer

As shown in FIG. 21, the stress relaxation layer 7F is located betweenthe IC 3F and the vibration element 6, and is disposed on the uppersurface of the IC 3F. By disposing the stress relaxation layer 7F, animpact received by the package 2 is relaxed, and it becomes difficultfor the impact to be transmitted to the vibration element 6. Further,the stress caused by the difference in thermal expansion between the IC3F and the vibration element 6 is relaxed, and it becomes difficult forthe vibration element 6 to bend. Therefore, the mechanical strength ofthe electronic device 1F can be increased, and at the same time, theangular velocity ωz can more accurately be detected.

Such a stress relaxation layer 7F has a first insulating layer 71Fstacked on the upper surface (on the passivation film 38) of the IC 3F,a first wiring pattern layer 72F disposed on the first insulating layer71F, a second insulating layer 73F disposed on the first insulatinglayer 71F and the first wiring pattern layer 72F, and a second wiringpattern layer 74F disposed on the second insulating layer 73F.

Further, the first insulating layer 71F and the second insulating layer73F each have elasticity. Therefore, the relaxation of the impactdescribed above can be achieved. The constituent material of such firstinsulating layer 71F and second insulating layer 73F is not particularlylimited, but there can be used a resin material such as polyimide,silicone-modified polyimide resin, epoxy resin, silicone-modified epoxyresin, acrylic resin, phenol resin, silicone resin, modified polyimideresin, benzocyclobutene, or polybenzooxazole. Thus, it is possible toform the first insulating layer 71F and the second insulating layer 73Feach having sufficient elasticity, and thus, the advantages describedabove can more surely be exerted.

Further, as shown in FIGS. 21 and 22, the second wiring pattern layer74F has six terminals (connection pads) 741 disposed so as to be opposedto the respective terminals (connection electrodes) 671 b through 674 bdisposed on the support sections 651, 652 of the vibration element 6,and four wiring sections 742F connected respectively to four of theterminals 741. Further, the vibration element 6 is fixed to theterminals 741 via the fixation members 8.

Further, as shown in FIG. 23, the first wiring pattern layer 72F haswiring sections 721F for electrically connecting the wiring sections742F of the second wiring pattern layer 74F and the connection terminals37 of the IC 3F, respectively. Thus, the IC 3F and the vibration element6 are electrically connected to each other via the fixation members 8and the stress relaxation layer 7F, and it is possible to transmit andreceive the signals between the IC 3F and the vibration element 6. Asdescribed above, the first wiring pattern layer 72F and the secondwiring pattern layer 74F function as a wiring (relocation wiring) forelectrically connecting the IC 3F and the vibration element 6 to eachother. Therefore, the connection terminals 37 of the IC 3F can freely bedisposed without taking the positions of the terminals 671 b through 674b of the vibration element 6 into consideration. Therefore, theflexibility in design of the electronic device 1F is enhanced.

Further, the first wiring pattern layer 72F has a shield wiring pattern722F besides the wiring sections 721F. The shield wiring pattern 722F isdisposed so as to spread on the first insulating layer 71F as long asthe arrangement of the wiring sections 721F is not hindered. Further,the shield wiring pattern 722F is electrically connected to a constantpotential. Here, the constant potential denotes a ground potential or apotential fixed to a certain potential. Such a shield wiring pattern722F is located between the second wiring pattern layer 74F and thewiring layer 32 of the IC 3F, and functions as a shield layer forreducing the capacitive coupling (the capacitance between the secondwiring pattern layer 74F and the wiring layer 32) between the secondwiring pattern layer 74F and the wiring layer 32. Therefore, bydisposing the shield wiring pattern 722F, the S/N ratio is improved, andthe electronic device 1F capable of more accurately detecting theangular velocity is obtained. Further, even in the case in which thenoise has temperature dependency, since the noise itself can be reduced,the electronic device 1F superior in temperature characteristics isobtained.

In the more specific explanation, as shown in FIG. 24A, the shieldwiring pattern 722F is disposed between wiring sections (the secondwiring pattern) 742Fa provided to the second wiring pattern layer 74Fand electrically connected to the detection signal terminals 671 b, anda wiring section 32Fa provided to the wiring layer 32F and electricallyconnected to the drive signal terminal 673 b. Therefore, mixture ofnoise from the wiring section 32Fa into the wiring sections 742Fa isreduced, and thus, a more accurate detection signal can be transmittedto the IC 3F. Similarly, as shown in FIG. 24B, the shield wiring pattern722F is disposed between a wiring section (the second wiring pattern)742Fb provided to the second wiring pattern layer 74F and electricallyconnected to the drive signal terminal 673 b, and wiring sections (thefirst wiring pattern) 32Fb provided to the wiring layer 32F andelectrically connected to the detection signal terminals 671 b.Therefore, mixture of noise from the wiring sections 742Fb into thewiring section 32Fb is reduced, and thus, a more accurate detectionsignal can be transmitted to the IC 3F. By disposing the shield wiringpattern 722F in such a manner as described above, the electronic device1F capable of more accurately detecting the angular velocity isobtained.

In particular, in the present embodiment, since the insulating layersare respectively disposed between the wiring sections 742Fa, 742Fb andthe shield wiring pattern 722F, and between the wiring sections 32Fa,32Fb and the shield wiring pattern 722F, it is possible to easilydispose the wiring sections 742Fa, 742Fb, 32Fa, and 32Fb, and the shieldwiring pattern 722F.

It should be noted that although in the present embodiment, there isexplained the configuration in which the wiring sections 32Fa, 32Fb aredisposed inside the fourth wiring pattern layer 328, it is sufficientfor the wiring sections 32Fa, 32Fb to be disposed in at least either oneof the first, second, third, and fourth wiring pattern layers 322, 324,326, 328F.

Here, the method of connecting the shield wiring pattern 722F to theground is not particularly limited. For example, it is also possible forthe shield wiring pattern 722F to be electrically connected to theground wiring included in the IC 3F. According to this method, since thewiring originally provided to the IC 3F can be used, there is obtainedan advantage that a complication (an increase in size) of the device isnot involved.

Further, as another method, it is also possible to dispose a dedicatedwiring, which connects the shield wiring pattern 722F to the ground, onthe upper surface (the fourth wiring pattern layer 328F) of the IC 3F,electrically connect the shield wiring pattern 722F to the dedicatedwiring, and electrically connect the dedicated wiring and the internalterminal 241 for grounding to each other with a bonding wire BW.According to such a method as described above, since the shield wiringpattern 722F can be connected to the ground without the intervention ofthe internal wiring of the IC 3F, the impedance of the wiring linebetween the shield wiring pattern 722F and the ground can be reduced.Therefore, the shield effect of the shield wiring pattern 722F canfurther be enhanced. It should be noted that in this method, it is alsopossible to share the internal terminal 241 for grounding with the IC3F, or to separately dispose the internal terminal 241 for the IC 3F andthe internal terminal 241 for the shield wiring pattern 722F, but it ispreferable to share the internal terminal 241. Thus, it is possible toprevent an increase in the number of components to thereby prevent anincrease in size and degradation in reliability of the device.

Further, as another method, it is also possible to directly connect theshield wiring pattern 722F to the internal terminal 241 for groundingdisposed on the package 2 with a bonding wire or the like without theintervention of a wiring disposed in the IC 3F or a wiring disposed onthe IC 3F. Thus, the configuration of the device becomes simpler.Further, it is possible to further decrease the impedance of the wiringline between the shield wiring pattern 722F and the ground.

Although in the present embodiment, the mixture of the noise from thewiring section electrically connected to the drive signal terminal intothe wiring sections electrically connected to the detection signalterminals is explained as an example, it is also possible to prevent themixture of noise from a communication circuit, which is provided to thewiring layer 32F, and is used for communicating with a host device. Inparticular, the communication circuit is high in operating frequency,and even low capacitance easily interferes with the operation of thecommunication circuit. Therefore, the electronic device 1F compatiblewith a high-frequency communication method, and superior in conveniencecan be provided.

Seventh Embodiment

FIG. 25 is a cross-sectional view of a stress relaxation layer providedto an electronic device according to a seventh embodiment of theinvention. FIGS. 26 through 28 are each a plan view of the stressrelaxation layer shown in FIG. 25. Hereinafter, the seventh embodimentwill be explained with a focus on the differences from the sixthembodiment described above, and regarding substantially the samematters, the same reference symbols are provided, and the explanationthereof will be omitted.

The electronic device according to the seventh embodiment is differentin the configuration of the stress relaxation layer from the sixthembodiment.

As shown in FIG. 25, the stress relaxation layer 7G provided to theelectronic device 1G according to the present embodiment includes afirst insulating layer 71G stacked on the upper surface (on thepassivation film 38) of the IC 3F, a first wiring pattern layer 72Gdisposed on the first insulating layer 71G, a second insulating layer73G disposed on the first insulating layer 71G and the first wiringpattern layer 72G, a second wiring pattern layer 74G disposed on thesecond insulating layer 73G, a third insulating layer 75G disposed onthe second insulating layer 73G and the second wiring pattern layer 74G,and a third wiring pattern layer 76G disposed on the third insulatinglayer 75G. In the stress relaxation layer 7G having such a configurationas described above, since the number of insulating layers havingelasticity is larger than, for example, that in the sixth embodimentdescribed above, the impact relaxation characteristic is furtherimproved.

Further, as shown in FIGS. 25 and 26, the third wiring pattern layer 76Ghas six terminals (connection pads) 761G disposed so as to be opposed tothe respective terminals (connection electrodes) 671 b through 674 bdisposed on the support sections 651, 652 of the vibration element 6.Further, the vibration element 6 is fixed to the terminals 761G via thefixation members 8. Further, the third wiring pattern layer 76G hasshield wiring pattern 762G. The shield wiring pattern 762G is disposedso as to spread on the third insulating layer 75G as long as thearrangement of the terminals 761G is not hindered. Further, the shieldwiring pattern 762G is electrically connected to a constant potential,in particular, to the ground in the present embodiment.

Further, as shown in FIG. 27, the second wiring pattern layer 74G haswiring sections 742G electrically connected to the terminals 761G.Further, as shown in FIG. 28, the first wiring pattern layer 72G haswiring sections 721G for electrically connecting the wiring sections742G of the second wiring pattern layer 74G and the connection terminals37 of the IC 3F, respectively, and shield wiring pattern 722G.

The shield wiring pattern 762G of the present embodiment is locatedbetween the second wiring pattern layer 74G and the vibration element 6,and therefore functions as a shield layer for reducing the capacitivecoupling between the second wiring pattern layer 74G and the vibrationelement 6. Therefore, by disposing the shield wiring pattern 762G, theelectronic device 1G capable of more accurately detecting the angularvelocity is obtained.

In the more specific explanation, since the shield wiring pattern 762Gis disposed between the wiring sections 742G provided to the secondwiring pattern layer 74G and electrically connected to the detectionsignal terminals 671 b, and the drive signal electrodes 673 a providedto the vibration element 6, mixture of noise from the drive signalelectrodes 673 a into the wiring sections 742G is reduced, and it ispossible to transmit a more accurate detection signal to the IC 3F.Similarly, since the shield wiring pattern 762G is disposed between thewiring section 742G provided to the second wiring pattern layer 74G andelectrically connected to the drive signal terminal 673 b, and thedetection signal electrodes 671 a provided to the vibration element 6,mixture of noise from the wiring section 742G into the detection signalelectrodes 671 a is reduced, and it is possible to transmit a moreaccurate detection signal to the IC 3F. By disposing the shield wiringpattern 762G in such a manner as described above, the electronic device1G capable of more accurately detecting the angular velocity isobtained.

According also to such a seventh embodiment as described above,substantially the same advantages as in the sixth embodiment describedabove can be obtained.

Eighth Embodiment

FIG. 29 is a cross-sectional view of an IC provided to an electronicdevice according to an eighth embodiment of the invention. Hereinafter,the eighth embodiment will be explained with a focus on the differencesfrom the sixth embodiment described above, and regarding substantiallythe same matters, the same reference symbols are provided, and theexplanation thereof will be omitted.

The electronic device according to the eighth embodiment is differentfrom the sixth embodiment in the configuration of the IC and the stressrelaxation layer.

As shown in FIG. 29, in the electronic device 1J according to thepresent embodiment, a shield wiring pattern 328Ja is disposed in the IC3J. Specifically, the shield wiring pattern 328Ja is disposed as a partof a fourth wiring pattern layer 328 provided to a wiring layer 32J ofthe IC 3J. By disposing the shield wiring pattern 328 a in the IC 3J asdescribed above, it is possible to exert substantially the sameadvantages as in the sixth embodiment described above, and at the sametime, the following advantages can further be exerted. That is, bydisposing the shield wiring pattern 328Ja in the IC 3J, in the stressrelaxation layer 7J, the first insulating layer 71F and the first wiringpattern layer 72F for disposing the shield wiring pattern can beomitted. Therefore, the stress relaxation layer 7J can be made thinner,and it is possible to achieve height reduction of the electronic device1J.

According also to such an eighth embodiment as described above,substantially the same advantages as in the sixth embodiment describedabove can be obtained.

Ninth Embodiment

FIG. 30 is a plan view of a vibration element provided to an electronicdevice according to a ninth embodiment of the invention. Hereinafter,the ninth embodiment will be explained with a focus on the differencesfrom the sixth embodiment described above, and regarding substantiallythe same matters, the same reference symbols are provided, and theexplanation thereof will be omitted.

The electronic device according to the ninth embodiment is different inthe configuration of the vibration element from the sixth embodiment.

The vibration element 5 provided to the electronic device 1K accordingto the present embodiment is a so-called “H-type” gyro element, and iscapable of detecting the angular velocity ωx around the X axis. As shownin FIG. 30, such a vibration element 5 has a vibrating element 50 madeof quartz crystal, and electrodes disposed on the vibrating element 50.It should be noted that the material of the vibrating element 50 is notlimited to quartz crystal, but it is also possible to use apiezoelectric material such as lithium tantalate or lithium niobate.

The vibrating element 50 has a plate-like shape having a spread in anx-y plane defined by an x axis (an electric axis) and a y axis (amechanical axis) as the crystal axes of the quartz crystal and athickness in a z-axis (an optical axis) direction. Further, thevibrating element 50 has a base section 51, a pair of drive vibratingarms 521, 522 extending from the base section 51 toward the −y-axis sidein parallel to each other, a pair of detection vibrating arms 531, 532extending from the base section 51 toward the +y-axis side in parallelto each other, a pair of adjustment vibrating arms 541, 542 extendingfrom the base section 51 toward the +y-axis side and located on bothsides of the detection vibrating arms 531, 532, a support section 55 forsupporting the base section 51, and connecting sections 56 forconnecting the base section 51 and the support section 55 to each other.It should be noted that in such a vibrating element 50, the base section51, the drive vibrating arms 521, 522, the detection vibrating arms 531,532, and the adjustment vibrating arms 541, 542 constitute a vibrationbody 500.

Such a vibration element 5 is fixed to the stress relaxation layer 7F inthe support section 55. Further, fixation of the vibration element 5 tothe stress relaxation layer 7F is achieved using fixation members 8, andthe vibration element 5 and the IC 3F are electrically connected to eachother via the fixation members 8 and the stress relaxation layer 7F.

The drive vibrating arms 521, 522 are provided with drive signalelectrodes not shown, and by applying an oscillation drive signal (analternating voltage) from the IC 3F to the drive signal electrodes, adrive mode indicated by the arrows D is excited. Then, when the angularvelocity ωx around the X axis is applied while the drive vibrating arms521, 522 are vibrating in the drive mode, a detection mode indicated bythe arrows E is excited, and thus, the detection vibrating arms 531, 532vibrate. The detection vibrating arms 531, 532 are provided withdetection signal electrodes not shown, and a detection signal (thecharge) generated by the vibration of the detection vibrating arms 531,532 is taken out through the detection signal electrodes. Then, the IC3F detects the angular velocity ωx based on the detection signal thustaken out.

According also to such a ninth embodiment as described above,substantially the same advantages as in the sixth embodiment describedabove can be obtained.

Tenth Embodiment

FIG. 31 is a perspective view showing an electronic device according toa tenth embodiment of the invention. FIG. 32 is a plan view of theelectronic device shown in FIG. 31. FIG. 33 is a plan view showing amodified example of the electronic device shown in FIG. 31. It should benoted that in FIG. 31, a lid is omitted from the drawing for the sake ofconvenience of explanation. Hereinafter, the tenth embodiment will beexplained with a focus on the differences from the sixth embodimentdescribed above, and regarding substantially the same matters, the samereference symbols are provided, and the explanation thereof will beomitted.

The tenth embodiment is different from the sixth embodiment in theconfiguration provided with a plurality of vibration elements.

The electronic device 1L according to the present embodiment is atriaxial angular velocity sensor, and is capable of detecting theangular velocity ωx around the X axis, the angular velocity ωy aroundthe Y axis, and the angular velocity oz around the Z axis independentlyof each other. Such an electronic device 1L has a package 2L providedwith a housing space S formed inside, an IC 3L housed in the package 2L,and three vibration elements 4, 5, and 6 disposed on the IC 3L via astress relaxation layer 7L. It should be noted that the vibrationelements 5, 6 each have substantially the same configuration asexplained in the above description of the embodiments, and the vibrationelement 4 has substantially the same configuration as that of thevibration element 5 except the point that vibration element is disposedin a different orientation.

IC

The IC 3L has a roughly rectangular planar shape, and the outer shape inthe planar view includes a pair of outer edges 3La, 3Lb disposed so asto extend in the Y-axis direction, and a pair of outer edges 3Lc, 3Lddisposed so as to extend in the X-axis direction as shown in FIG. 32.

The IC 3L includes, for example, an interface section 3 i forcommunicating with an external host device, a drive/detection circuit 3y for driving the vibration element 4 to detect the angular velocity ωyapplied to the vibration element 4, a drive/detection circuit 3 x fordriving the vibration element 5 to detect the angular velocity ωxapplied to the vibration element 5, and a drive/detection circuit 3 zfor driving the vibration element 6 to detect the angular velocity ωzapplied to the vibration element 6.

Here, as shown in FIG. 32, a plurality of connection terminals 39 isdisposed separately in three areas, namely a first terminal arrangementarea SS1, a second terminal arrangement area SS2, and a third terminalarrangement area SS3, set on the upper surface of the IC 3L. The firstterminal arrangement area SS1 is disposed along the outer edge 3Lc so asto be shifted toward the outer edge 3La, the second terminal arrangementarea SS2 is disposed along the outer edge 3Ld so as to be shifted towardthe outer edge 3La, and the third terminal arrangement area SS3 isdisposed along the outer edge 3Lb so as to be shifted toward the outeredge 3Ld.

In the first terminal arrangement area SS1, there are disposed digitalsignal terminals in a lump such as a digital signal terminal for a slaveselection signal SS for selecting a communication method, a digitalsignal terminal for a data input signal MOSI, a digital signal terminalfor a clock signal SCLK, and a digital signal terminal for a data outputsignal MISO. Further, in the second terminal arrangement area SS2 andthe third terminal arrangement area SS3, there are disposed analogsignal terminals in a lump such as a ground terminal for the ground GND,a power supply signal terminal for the power supply VDDI of theinterface section 3 i, a power supply signal terminal for the powersupply VDD of the drive/detection circuits 3 x, 3 y, and 3 z, and a testsignal terminal for testing.

By disposing the digital signal terminals and the analog signalterminals separately in the respective areas different from each otheras described above, mixture of digital signals into the analog signalterminals (wiring) can be reduced. Therefore, the electronic device 1Lcapable of reducing the noise, and thus capable of performing moreaccurate drive is obtained. In particular, in the present embodiment,since there is adopted an arrangement of disposing the first terminalarrangement area SS1 distant from the second terminal arrangement areaSS2 and the third terminal arrangement area SS3 as much as possible, theadvantages described above can more effectively be exerted.

Arrangement of Vibration Elements

As shown in FIG. 32, the vibration element 4 is arranged so that adetection axis J4 coincides with the Y axis. Thus, the vibration element4 can detect the angular velocity ωy. Further, the vibration element 4is disposed on the upper surface of the IC 3L at a position shiftedtoward the outer edge 3Lb and the outer edge 3Ld. Further, on the+X-axis side of the vibration element 4 (between the vibration element 4and the outer edge 3Lb), there is located the third terminal arrangementarea SS3, and on the −X-axis side of the vibration element 4 (betweenthe vibration element 4 and the outer edge 3La), there is located thesecond terminal arrangement area SS2. Further, the vibration element 4is disposed so that the detection vibrating arms 431, 432 and theadjustment vibrating arms 441, 442 protrude from the outer edge 3Ld ofthe IC 3L toward the +Y side in a planar view. In other words, thevibration element 4 is disposed so that the detection vibrating arms431, 432 and the adjustment vibrating arms 441, 442 do not overlap theIC 3L in the planar view.

Then an arrangement of the vibration element 5 will be explained. Asshown in FIG. 32, the vibration element 5 is arranged so that adetection axis J5 coincides with the X axis. Thus, the vibration element5 can detect the angular velocity ωx. Further, the vibration element 5is disposed on the upper surface of the IC 3L at a position shiftedtoward the outer edge 3Lb and the outer edge 3Lc. Therefore, thevibration element 5 is located on the −Y-axis side with respect to thevibration element 4 (between the vibration element 4 and the outer edge3Lc). Further, on the −X-axis side of the vibration element 5 (betweenthe vibration element 5 and the outer edge 3La), there is located thefirst terminal arrangement area SS1. Further, the vibration element 5 isdisposed so that the detection vibrating arms 531, 532 and theadjustment vibrating arms 541, 542 protrude from the outer edge 3Lb ofthe IC 3L toward the +X side in the planar view.

Then an arrangement of the vibration element 6 will be explained. Asshown in FIG. 32, the vibration element 6 is arranged so that adetection axis J6 coincides with the Z axis. Thus, the vibration element6 can detect the angular velocity (oz. Further, the vibration element 6is disposed on the upper surface of the IC 3L at a position shiftedtoward the outer edge 3La. Therefore, the vibration element 6 is locatedon the −X-axis side with respect to the vibration elements 4, 5 (betweenthe vibration elements 4, 5 and the outer edge 3La). Further, on the−Y-axis side of the vibration element 6 (between the vibration element 6and the outer edge 3Lc), there is located the first terminal arrangementarea SS1, and on the +Y-axis side (between the vibration element 6 andthe outer edge 3Ld), there is located the second terminal arrangementarea SS2.

Further, the vibration element 6 is disposed so as to be shifted towardthe second terminal arrangement area SS2 rather than the first terminalarrangement area SS1. In other words, the vibration element 6 isdisposed so that the distance DSS2 from the second terminal arrangementarea SS2 is shorter than the distance DSS1 from the first terminalarrangement area SS1. Thus, it is possible to make the vibration element6 distant from the first terminal arrangement area SS1 as much aspossible, and thus, the mixture of the digital signal into the vibrationelement 6 is reduced. Therefore, the electronic device 1L capable ofreducing the mixture of noise into the drive signal or the detectionsignal, and thus capable of performing more accurate drive is obtained.

Further, the vibration element 6 is disposed so that the direction, inwhich the support sections 651, 652 are arranged, coincides with theY-axis direction. Since the length of the vibration element 6 in thedirection, in which the support sections 651, 652 are arranged, islarger than the length thereof in the direction (the direction in whichthe connecting arms 631, 632 extend) perpendicular to the direction, inwhich the support sections 651, 652 are arranged, by disposing thevibration element 6 as described above, it is possible to make effectiveuse of the space on the upper surface of the IC 3L. Therefore, forexample, the distance between the outer edges 3La, 3Lb can be madeshorter, and miniaturization of the IC 3L can be achieved.

By disposing the vibration elements 4, 5 in an area located on the uppersurface of the IC 3L and on the outer edge 3Lb side so as to be arrangedside by side in the Y-axis direction, and further disposing thevibration element 6 in an area located on the upper surface of the IC 3Land on the outer edge 3La side as described above, it is possible todispose these three vibration elements 4, 5, and 6 in a relatively smallspace. Therefore, miniaturization of the IC 3L can be achieved, andaccordingly, miniaturization of the electronic device 1L can beachieved.

Stress Relaxation Layer

The stress relaxation layer 7L has a first stress relaxation layer 7Ladisposed between the IC 3L and the vibration element 4, and having thevibration element 4 disposed on the upper surface thereof, a secondstress relaxation layer 7Lb disposed between the IC 3L and the vibrationelement 5, and having the vibration element 5 disposed on the uppersurface thereof, and a third stress relaxation layer 7Lc disposedbetween the IC 3L and the vibration element 6, and having the vibrationelement 6 disposed on the upper surface thereof. By dividing the stressrelaxation layer 7L into the parts corresponding respectively to thevibration elements 4, 5, and 6 in such a manner as described above, itbecomes difficult for the vibrations of the vibration elements 4, 5, and6 from propagating to each other. Therefore, it is possible for each ofthe vibration elements 4, 5, and 6 to more accurately detect the angularvelocity. It should be noted that although the configuration of each ofthe first stress relaxation layer 7La, the second stress relaxationlayer 7Lb, and the third stress relaxation layer 7Lc is substantiallythe same as the configuration of the stress relaxation layer 7Fdescribed in the description of the sixth embodiment, and therefore theexplanation thereof will be omitted, it is also possible to use theconfiguration of the stress relaxation layer 7G described in thedescription of the seventh embodiment.

According also to such a tenth embodiment as described above,substantially the same advantages as in the sixth embodiment describedabove can be obtained.

Modified Example

Although in the tenth embodiment described above, the stress relaxationlayer 7L is divided into the first stress relaxation layer 7La, thesecond stress relaxation layer 7Lb, and the third stress relaxationlayer 7Lc, it is also possible to adopt an electronic device 1M providedwith a stress relaxation layer 7M obtained by integrally forming a firststress relaxation layer 7Ma, a second stress relaxation layer 7Mb, andthe third stress relaxation layer 7Mc with each other as shown in FIG.33, for example. In other words, it is also possible to dispose threevibration elements 4, 5, and 6 on the single stress relaxation layer 7M.Thus, since the gaps between the first stress relaxation layer 7La, thesecond stress relaxation layer 7Lb, and the third stress relaxationlayer 7Lc are eliminated, mixture of the noise through the gaps isprevented, and thus, the shield effect can be improved.

Electronic Apparatus

Then, the electronic apparatus to which the electronic device is appliedwill be explained in detail with reference to FIGS. 34 through 36.Although the explanation is hereinafter presented citing the example ofapplying the electronic device 1, it is also possible to apply eitherone of the electronic devices 1A through 1M instead of the electronicdevice 1.

FIG. 34 is a perspective view showing a configuration of a mobile type(or laptop type) personal computer as an example of the electronicapparatus equipped with the electronic device according to theembodiment of the invention.

In the drawing, the personal computer 1100 includes a main body section1104 provided with a keyboard 1102, and a display unit 1106 providedwith a display section 1108, and the display unit 1106 is pivotallysupported with respect to the main body section 1104 via a hingestructure. Such a personal computer 1100 incorporates the electronicdevice 1 functioning as an angular velocity sensor (a gyro sensor).Therefore, the personal computer 1100 is higher in performance, and canbe provided with high reliability.

FIG. 35 is a perspective view showing a configuration of a cellularphone (including PHS) as an example of the electronic apparatus equippedwith the electronic device according to the embodiment of the invention.

In this drawing, the cellular phone 1200 is provided with a plurality ofoperation buttons 1202, an ear piece 1204, and a mouthpiece 1206, and adisplay section 1208 is disposed between the operation buttons 1202 andthe ear piece 1204. Such a cellular phone 1200 incorporates theelectronic device 1 functioning as the angular velocity sensor (the gyrosensor). Therefore, the cellular phone 1200 is higher in performance,and can be provided with high reliability.

FIG. 36 is a perspective view showing a configuration of a digital stillcamera as an example of the electronic apparatus equipped with theelectronic device according to the embodiment of the invention. Itshould be noted that the connection with external equipment is alsoshown briefly in this drawing.

The digital still camera 1300 performs photoelectric conversion on anoptical image of an object using an imaging element such as CCD (ChargeCoupled Device) to thereby generate an imaging signal (an image signal).A case (a body) 1302 of the digital still camera 1300 is provided with adisplay section 1310 disposed on the back surface of the case 1302 toprovide a configuration of performing display in accordance with theimaging signal from the CCD, wherein the display section 1310 functionsas a viewfinder for displaying the object as an electronic image.Further, the front surface (the back side in the drawing) of the case1302 is provided with a light receiving unit 1304 including an opticallens (an imaging optical system), the CCD, and so on. When thephotographer checks an object image displayed on the display section1310, and then holds down a shutter button 1306, the imaging signal fromthe CCD at that moment is transferred to and stored in a memory device1308.

Further, the digital still camera 1300 is provided with video signaloutput terminals 1312 and an input/output terminal 1314 for datacommunication disposed on a side surface of the case 1302. Further, asshown in the drawing, a television monitor 1430 and a personal computer1440 are respectively connected to the video signal output terminals1312 and the input-output terminal 1314 for data communication accordingto needs. Further, there is adopted the configuration in which theimaging signal stored in the memory device 1308 is output to thetelevision monitor 1430 and the personal computer 1440 in accordancewith a predetermined operation.

Such a digital still camera 1300 incorporates the electronic device 1functioning as the angular velocity sensor (the gyro sensor). Therefore,the digital still camera 1300 is higher in performance, and can beprovided with high reliability.

It should be noted that, as the electronic apparatus equipped with theelectronic device, there can be cited, for example, an inkjet ejectiondevice (e.g., an inkjet printer), a laptop personal computer, atelevision set, a video camera, a video cassette recorder, a carnavigation system, a pager, a personal digital assistance (including onewith communication function), an electronic dictionary, an electriccalculator, a computerized game machine, a word processor, aworkstation, a video phone, a security video monitor, a pair ofelectronic binoculars, a POS terminal, a medical device (e.g., anelectronic thermometer, an electronic manometer, an electronic bloodsugar meter, an electrocardiogram measurement instrument, anultrasonograph, and an electronic endoscope), a fish detector, varioustypes of measurement instruments, various types of gauges (e.g., gaugesfor a vehicle, an aircraft, or a ship), and a flight simulator, besidesthe personal computer (the mobile personal computer) shown in FIG. 34,the cellular phone shown in FIG. 35, and the digital still camera shownin FIG. 36.

Moving Object

Then, the moving object to which the electronic device is applied willbe explained in detail with reference to FIG. 37. Although theexplanation is hereinafter presented citing the example of applying theelectronic device 1, it is also possible to apply either one of theelectronic devices 1A through 1M instead of the electronic device 1.

FIG. 37 is a perspective view showing a configuration of a vehicle towhich the moving object equipped with the electronic device according tothe embodiment of the invention is applied.

The vehicle 1500 incorporates the electronic device 1 functioning as theangular velocity sensor (the gyro sensor), and the attitude of a vehiclebody 1501 can be detected using the electronic device 1. The detectionsignal of the electronic device 1 is supplied to the vehicle bodyattitude control device 1502, and the vehicle body attitude controldevice 1502 detects the attitude of the vehicle body 1501 based on thedetection signal, and it is possible to control the stiffness of thesuspension or control the brake of each of wheels 1503 in accordancewith the detection result. Besides the above, such posture control asdescribed above can be used for a two-legged robot and a radio controlhelicopter. As described above, in realizing the posture control of avariety of types of moving objects, the electronic device 1 isincorporated.

Although the electronic device, the electronic apparatus, and the movingobject according to the invention are described based on the embodimentsshown in the accompanying drawings, the invention is not limited tothese embodiments, but the constituents of each of the sections can bereplaced with those having an identical function and any configuration.Further, it is also possible to add any other constituents to theinvention. Further, the invention can be the combination of any two ormore configurations (features) of the embodiments described above.

Further, although in some of the embodiments described above, theconfiguration in which a single vibration element is disposed on the ICis explained, the number of the vibration elements is not particularlylimited, and it is also possible to dispose, for example, a vibrationelement capable of detecting the angular velocity around the X axis, avibration element capable of detecting the angular velocity around the Yaxis, and a vibration element capable of detecting the angular velocityaround the Z axis.

Further, although in the embodiments described above, the angularvelocity sensor as the electronic device is explained, the electronicdevice is not limited to the angular velocity sensor, but can also be,for example, an oscillator for outputting a signal with a predeterminedfrequency, or a physical quantity sensor capable of detecting a physicalquantity (e.g., acceleration or atmospheric pressure) other than theangular velocity, or the like.

Further, although in the embodiments described above, a device having aconfiguration, in which the electrodes are disposed on the vibratingelement formed of a quartz crystal substrate (a piezoelectricsubstrate), is used as the vibration element, the configuration of thevibration element is not limited thereto. It is also possible to adopt avibration element having a configuration in which, for example, apiezoelectric element is disposed on the vibrating element obtained bypattering the silicon substrate, and a voltage is applied to thepiezoelectric element to make the piezoelectric element expand andcontract, to thereby make the vibrating element vibrate.

The entire disclosure of Japanese Patent Application Nos: 2014-219774,filed Oct. 28, 2014 and 2014-219775, filed Oct. 28, 2014 are expresslyincorporated by reference herein.

What is claimed is:
 1. An electronic device comprising: a vibrationelement including a vibration body and an electrode provided to thevibration body; a semiconductor substrate disposed so as to be opposedto the vibration element; a first wiring pattern located between thesemiconductor substrate and the vibration element; a second wiringpattern located between the first wiring pattern and the vibrationelement, and different in potential from the first wiring pattern; and ashield wiring pattern disposed at least a part of an area, which islocated between the first wiring pattern and the second wiring pattern,and in which the first wiring pattern and the second wiring patternoverlap each other in a planar view, the shield wiring pattern beingelectrically connected to a constant potential.
 2. The electronic deviceaccording to claim 1, wherein the vibration body includes a drivevibrating section and a detection vibrating section, the electrodeincludes a drive signal electrode disposed in the drive vibratingsection and a detection signal electrode disposed in the detectionvibrating section, and one of the first wiring pattern and the secondwiring pattern is electrically connected to the drive signal electrode,and the other of the first wiring pattern and the second wiring patternis electrically connected to the detection signal electrode.
 3. Theelectronic device according to claim 1, wherein the shield wiringpattern is grounded.
 4. The electronic device according to claim 1,further comprising: an insulating layer disposed between the firstwiring pattern and the shield wiring pattern.
 5. The electronic deviceaccording to claim 1, further comprising: an insulating layer disposedbetween the second wiring pattern and the shield wiring pattern.
 6. Theelectronic device according to claim 4, wherein the insulating layer haselasticity.